Use Less Material with TIM™. Heat dissipation is often the limiting factor for performance and reliability of today’s electronic systems. Thermal Interface Materials (TIMs) reduce the interfacial thermal contact resistance which arises from microscopic surface roughness and non-planarity between solid surfaces. The high performance, cost effective XG TIM™ platform provides low impedance thermal pathways for efficient heat transfer from the device to the heat pipe or heat sink.
SG-201 has an additional $126 HazMat shipping cost per quantity.